Today, the Biden-Harris Administration announced that the U.S. Department of Commerce and Samsung Electronics (Samsung) have signed a non-binding preliminary memorandum of terms (PMT) to provide up to $6.4 billion in direct funding under the CHIPS and Science Act to strengthen the resilience of the U.S. semiconductor supply chain, advance U.S. technology leadership, and fuel U.S. global competitiveness.
SMU Prof to Use NSF Grant to Develop Game-Based Semiconductor Curriculum for High School Students
Innovative project aims to bridge knowledge gaps and inspire future semiconductor professionals.
Stretchable Quantum Dot Display
Intrinsically stretchable quantum dot-based light-emitting diodes achieved record-breaking performance.
Fortemedia Unveils Coil-based MEMS Speaker Product Family
Fortemedia Inc. announces the launch of its latest innovation, the Coil-based MEMS Speaker Product Family, ForteSound, and its first product FS01.
SweGaN Announces RFHIC Strategic Equity Investment and Joint Product Development
SweGaN AB announces it has entered strategic partnership with South Korea based RFHIC Corporation.
Microchip Technology Acquires Neuronix AI Labs
Microchip Technology has acquired Neuronix AI Labs to expand its capabilities for power-efficient, AI-enabled edge solutions deployed on field programmable gate arrays (FPGAs).
Universal Display Corporation’s Dr. Julie Brown to Receive Prestigious USC Viterbi Engineering Award
Universal Display Corporation announced that the University of Southern California (USC) will be honoring UDC’s Executive Vice President and Chief Technical Officer, Dr. Julie Brown, with the Daniel J. Epstein Engineering Management Award.
Renesas Commences Operations of Kofu Factory
Renesas Electronics Corporation today announced that it has started operations at its Kofu Factory, located in Kai City, Yamanashi Prefecture, Japan.
A Novel Machine Learning Model for the Characterization of Material Surfaces
Machine learning (ML) enables the accurate and efficient computation of fundamental electronic properties of binary and ternary oxide surfaces, as shown by scientists from Tokyo Tech.
IMAPS & IPC to Host Onshoring Workshop
The International Microelectronics Assembly and Packaging Society (IMAPS) and IPC will host a Workshop to discuss ongoing progress and forward-looking strategies to drive the Onshoring Advanced Packaging and Assembly, April 29 – May 1, 2024, in Arlington, Virginia.
